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bonding pad
释义
bonding pad
bonding pad
[
′bän·diŋ ‚pad
]
(electronics)
A metallized area on the surface of a semiconductor device, to which connections can be made.
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neat tiling
neat work
neat’s-foot oil
neau
neavs
neawp
neax
neazdp
neb
neba
nebaba, anton
nebai
ne baila pas
nebaioth
nebajoth
nebalia
nebaliacea
neballat
nebat
nebata
nebb
nebba
nebbech
nebbi
nebbish
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更新时间:2026/6/26 10:16:10