wire bonding

[′wīr ‚bänd·iŋ] (electricity) Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered. (electronics) A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate. The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.

单词	wire bonding
释义	wire bonding wire bonding [′wīr ‚bänd·iŋ] (electricity) Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered. (electronics) A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate. The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.
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