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solder bumping
释义
solder bumping
solder bumping
A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.
Medical
See
BGA
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英语词典包含2567994条英英释义在线翻译词条,基本涵盖了全部常用单词的英英翻译及用法,是英语学习的有利工具。
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更新时间:2026/9/3 20:10:20