tape-automated bonding


tape-automated bonding

[¦tāp ‚ȯd·ə‚mād·əd ′bän·diŋ] (electronics) A semiconductor chip (die) assembly method, where the chips are connected to polyimide (tape) carriers, complete with circuitry for attachment to a printed circuit board. The chip-bonded tape carriers typically are supplied on a reel (like a roll of film) for automated circuit assembly processes.