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单词
mallory bonding
释义
Mallory bonding
Mallory bonding
[
′mal·ə·rē ‚bänd·iŋ
]
(design engineering)
Hermetically sealing polished silicon chips to polished glass plates by placing the two pieces together, heating them to about 350°C (662°F), and applying approximately 8000 volts across the assembly.
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更新时间:2025/3/29 16:10:48